Interfacial intermetallic phases and nanoeutectic in rapidly quenched Sn-Ag-Cu on Au under bump metallization
- Interfacial intermetallic phases and nanoeutectic in rapidly quenched Sn-Ag-Cu on Au under bump metallization
- 발리; 에릭플러리; 한승희; 안재평
- Microstructure; Phase diagram; Transmission electron microscopy; Laser processing; TEM; Scanning electron microscopy; SEM
- Issue Date
- Journal of alloys and compounds
- VOL 457, NO 1-2, 113-117
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- KIST Publication > Article
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