Adhesion and friction forces on silicon wafers with dual surface modifications at nano-scale
- Adhesion and friction forces on silicon wafers with dual surface modifications at nano-scale
- 나경환; Arvind Singh; Pham Duc Cuong; 양성욱; 윤의성
- Surface modification; topographical; chemical; nano-channel; adhesion; frictioin; tribology
- Issue Date
- Society of Tribologists and Lubrication Engineers 64th Annual Meeting and Exhibition
- Surfaces of silicon wafers were topographically and chemically modified. As the first step, nanochannels
were fabricated on silicon wafers using MEMS fabrication process. Next, the nano-channeled
surfaces were coated with DLC thin film (20 nm thickness). Adhesion and friction forces on these surfaces
were measured using an AFM. Results showed that the chemical and topographical modifications
reduced the surface forces. Further, a combination of both the kinds of modifications was even more
effective in decreasing the surface forces, owing to the combined effects of reduced real area of contact
and lower interfacial energies. It is proposed that the combined surface modification is a potential route to
enhance the tribological performance of elements of MEMS devices.
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