Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling
- Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling
- 강상우; 황규대; 문종민; 김서영
- Mini liquid-cooled cold plate; thermal resistance; pin-finned copper; aluminum foam; overall heat transfer coefficient
- Issue Date
- InterPACK'09 Conference
- , NO 89410, 1-6
- Thermal performance for mini water-cooled cold plates
covered with non-metallic polycarbonate (PC) is
experimentally measured in this study. The mini cold plates are
designed to reduce the overall weight of the cooling device for
effective heat dissipation from a humanoid robot. The watercooled
cold plate has a 10×10 mm2 of base plate which is made
of copper or aluminum. Two different types of enhanced
surfaces are considered in the present study: copper pin-finned
surface of 0.5×0.5 mm2 area and 1.5 mm high with 0.5 mm fin
spacing and aluminum foam-finned surface of 92% porosity
and 40 PPI (pores per inch). Heat transfer rates are measured
according to the input power and the flow rate of cooling water.
The surface temperature of the base plate and the cooling water
temperatures at inlet and outlet of each cold plate are measured.
From the results, it is found that the copper pin-finned cold
plate shows better performance than the aluminum foam-finned
cold plate in terms of thermal resistance and pressure drop.
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