Non-destructive evaluation of nano-sized structure of thin film devices by using small angle neutron scattering
- Non-destructive evaluation of nano-sized structure of thin film devices by using small angle neutron scattering
- E.J.Shin; B.S.Seong; 최용; 이전국
- plasma discharge; plasma focus; layer deposition; small angle neutron scattering
- Issue Date
- Journal of nanoscience and nanotechnology
- VOL 11, NO 1, 876-879
- Nano-sized multi-layers copper-doped SrZrO3, platinum (Pt) and silicon oxide (SiO2) on silicon
substrates were prepared by dense plasma focus (DPF) device with the high purity copper anode tip
and analyzed by using small angle neutron scattering (SANS) to establish a reliable method for the
non-destructive evaluation of the under-layer structure. Thin film was well formed at the time-to-dip
of 5 μsec with stable plasma of DPF. Several smooth intensity peaks were periodically observed
when neutron beam penetrates the thin film with multi-layers perpendicularly. The platinum layer is
dominant to intensity peaks, where the copper-doped SrZnO3 layer next to the platinum layer causes
peak broadening. The silicon oxide layer has less effect on the SANS spectra due to its relative
thick thickness. The SANS spectra shows thicknesses of platinum and copper-doped SrZnO3 layers
as 53 and 25 nm, respectively, which are well agreement with microstructure observation.
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