Thermal stability of Cu/WN/Si nano via contact structures

Title
Thermal stability of Cu/WN/Si nano via contact structures
Authors
황영현조원주김영환김용태
Keywords
Cu via; Contact resistance; Thermal stability; WN; Diffusion barrier
Issue Date
2011-10
Publisher
Microprocesses and Nanotechnology Conference 2011
Citation
, p-11-58
Abstract
We can prepare the WN diffusion barrier without encroachment by using WF6, B2H5, and NH3 gas system. Although the ALD process is well controlled with W2(NMe2)6 precursor, the C content is not successfully eliminated. Experimental result shows that the thermal stability of Cu/WN/Si contact is superior to that of Cu/TiN/Si contact.
URI
http://pubs.kist.re.kr/handle/201004/40570
Appears in Collections:
KIST Publication > Conference Paper
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