Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

Title
Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics
Authors
류종은김학성한홍택
Keywords
Intense Pulsed Light; Printed Electronics; Copper Nanoparticle; reactive sintering; copper oxide
Issue Date
2011-01
Publisher
Journal of electronic materials
Citation
VOL 40, NO 1, 42-50
Abstract
Most commercial copper nanoparticles are covered with an oxide shell and cannot be sintered into conducting lines/films by conventional thermal sin- tering. To address this issue, past efforts have utilized complex reduction schemes and sophisticated chambers to prevent oxidation, thereby rendering the process cost ineffective. To alleviate these problems, we demonstrate a reactive sintering process using intense pulsed light (IPL) in the present study. The IPL process successfully removed the oxide shells of copper nanoparticles, leaving conductive, pure copper film in a short period of time (2 ms) under ambient conditions. The in situ copper oxide reduction mecha- nism was studied using several different experiments and analyses. We observed instant copper oxide reduction and sintering through poly(N-vinyl- pyrrolidone) functionalization of copper nanoparticles, followed by IPL irra- diation. This phenomenon may be explained by oxide reduction either via an intermediate acid created by ultraviolet (UV) light irradiation or by hydroxyl (-OH) end groups, which act like long-chain alcohol reductants.
URI
http://pubs.kist.re.kr/handle/201004/41895
ISSN
0361-5235
Appears in Collections:
KIST Publication > Article
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