Effect of surface tension and coefficient of thermal expansion in 30 nm scale nanoimprinting with two flexible polymer molds
- Effect of surface tension and coefficient of thermal expansion in 30 nm scale nanoimprinting with two flexible polymer molds
- 김재관; 조혜성; 정호섭; 임기필; 김기범; 최대근; 정준호; 서갑양
- nanoimprint; high resolution; uv curing
- Issue Date
- VOL 23, 235303-1-235303-9
- We report on nanoimprinting of polymer thin films at 30 nm scale resolution using two types
of ultraviolet (UV)-curable, flexible polymer molds: perfluoropolyether (PFPE) and
polyurethane acrylate (PUA). It was found that the quality of nanopatterning at the 30 nm scale
is largely determined by the combined effects of surface tension and the coefficient of thermal
expansion of the polymer mold. In particular, the polar component of surface tension may play
a critical role in clean release of the mold, as evidenced by much reduced delamination or
broken structures for the less polarized PFPE mold when patterning a relatively hydrophilic
PMMA film. In contrast, such problems were not notably observed with a relatively
hydrophobic PS film for both polymer molds. In addition, the demolding characteristic was
also influenced by the coefficient of thermal expansion so that no delamination or uniformity
problems were observed when patterning a UV-curable polymer film at room temperature.
These results suggest that a proper polymeric mold material needs to be chosen for patterning
polymer films under different surface properties and processing conditions, providing insights
into how a clean demolding characteristic can be obtained at 30 nm scale nanopatterning.
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