Piezoelectric properties of highly densified 0.01Pb(Mg1/2W1/2)O3-0.41Pb(Ni1/3Nb2/3)O3-0.35PbTiO3-0.23PbZrO3+0.1 wt% Y2O3+1.5 wt% ZnO thick films on alumina substrate
- Piezoelectric properties of highly densified 0.01Pb(Mg1/2W1/2)O3-0.41Pb(Ni1/3Nb2/3)O3-0.35PbTiO3-0.23PbZrO3+0.1 wt% Y2O3+1.5 wt% ZnO thick films on alumina substrate
- 신태희; 하종윤; 송현철; 윤석진; 박형호; 최지원
- Piezoelectric thick film; screen printing; particle size control; cold isostatic pressing
- Issue Date
- Ceramics international
- VOL 39, NO 2, 1327-1333
- This paper reports on the formation of highly densified piezoelectric thick films of 0.01Pb(Mg1/2W1/2)O3–0.41Pb(Ni1/3Nb2/3)O3–
0.35PbTiO3–0.23PbZrO3þ0.1 wt% Y2O3þ1.5 wt% ZnO (PMW–PNN–PT–PZþYZ) on alumina substrate by the screen-printing
method. To increase the packing density of powder in screen-printing paste, attrition milled nano-scale powder was mixed with ball
milled micro-scale powder, while the particle size distribution was properly controlled. Furthermore, the cold isostatic pressing process
was used to improve the green density of the piezoelectric thick films. As a result of these processes, the PMW–PNN–PT–PZþYZ thick
film, sintered at 890 1C for 2 h, showed enhanced piezoelectric properties such as Pr=42 μC/㎠, Ec=25 kV/cm, and d33=100 pC/N, in
comparison with other reports. Such prominent piezoelectric properties of PMW–PNN–PT–PZþYZ thick films using bi-modal particle
distribution and the CIP process can be applied to functional thick films in MEMS applications such as micro actuators and sensors.
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