Al-AlN composite manufactured by gas reaction method for high thermal conductivity and low thermal expansion

Title
Al-AlN composite manufactured by gas reaction method for high thermal conductivity and low thermal expansion
Authors
김효진박경원장혜정이건재이재철안재평
Keywords
LED; Thermal conductivity; Low thermal expansion
Issue Date
2012-02
Publisher
ACCMM@@/ICON2012/APMC 10 2012
Abstract
Optimum heat-sink materials of LED devices have been expected to improve using LED’s life-time. Low thermal conductivity and high thermal expansion of the heat-sink materials cause bad efficiency and become a main reason to reduce life-time. Although Al is a good material for heat-sink applications, it has high thermal expansion coefficient. Therefore it needs complex composite with low thermal expansion such as AlN and Si3N4. In this study, we try to manufacture Al-AlN composites with high thermal conductivity and low thermal expansion coefficient. In particular, the formation mechanism of AlN was investigated with the role of Mg catalyst and the processing temperature.
URI
http://pubs.kist.re.kr/handle/201004/44276
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE