Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness

Title
Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness
Authors
정정규황농문박영준주영창
Keywords
Cu damascene interconnects; Three-dimensional simulation; microstructure
Issue Date
2005-05
Publisher
Journal of electronic materials
Citation
VOL 34, NO 5, 559-563
URI
http://pubs.kist.re.kr/handle/201004/45361
ISSN
0361-5235
Appears in Collections:
KIST Publication > Article
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