Effects of surfactant and preplate process on electroless copper plating on carbon nano-fiber

Title
Effects of surfactant and preplate process on electroless copper plating on carbon nano-fiber
Authors
한준현석현광이상수지광구
Keywords
carbon nano-fiber; electroless plating; copper; surfactant; preplate process
Issue Date
2009-05
Publisher
한국분말야금학회지; Journal of Korean Powder Metallurgy Institute
Citation
VOL 16, NO 2, 131-137
Abstract
This paper deals with the effects of the surfactant and preplate process (sensitization and activation) on electroless copper plating on carbon nano-fiber (CNF). Ultrasonic irradiation was applied both during dispersion of CNF and during electroless plating containing preplate process. The dispersion of CNF and flatness of the plated copper film were discussed based on the changes in surfactant concentration and preplate process time. It was clearly shown that high concentration of surfactant and long time of preplate process could promote the agglomeration of CNF and uneven copper plating on CNF.
URI
http://pubs.kist.re.kr/handle/201004/45512
ISSN
1225-7591
Appears in Collections:
KIST Publication > Article
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