Deposition of Palladium Catalyzed Copper Films by the Displacement of Two Immiscible Supercritical Phases and Subsequent Reaction
- Deposition of Palladium Catalyzed Copper Films by the Displacement of Two Immiscible Supercritical Phases and Subsequent Reaction
- 김재훈; R. G. Carbonell
- Issue Date
- Journal of materials chemistry
- VOL 20, NO 19, 3973-3978
- Palladium (Pd) catalyzed copper (Cu) films were produced by forming films of Cu(II) compound
(Cu(hfac)2$H2O) and Pd(II) compound (Pd(hfac)2) on silicon oxide (SiOx) and titanium nitride (TiN)
substrates using a Displacement from two Immiscible Supercritical Phases (DISPs) technique followed
by reduction of the organometallic compounds films in hydrogen at 200 ℃. The morphology of Cu
films was observed using scanning electron microscopy (SEM) and atomic force microscopy (AFM).
In the absence of Pd(hfac)2, Cu particles in the range of 60–95 nm formed on SiOx or TiN during the
5 min reduction period. As the Pd(hfac)2 concentration increased to 5 mol% (relative to the amount of
Cu(hfac)2·H2O), a morphology transition from particle formation to film formation was observed.
When the Cu(hfac)2·H2O concentration varied from 0.1 wt% to 3 wt% at a fixed Pd(hfac)2
concentration of 5 mol%, highly uniform, dense and adherent films with 10–40 nm in thickness were
produced. Root mean square (rms) roughness of these films, estimated by AFM images, is in the
range of 1.7–5.8 nm. Chemical composition analysis of 5 mol% Pd catalyzed Cu film by X-ray
photoelectron spectroscopy (XPS) revealed that approximately the ratio of Pd to Cu incorporated into
the film was two times larger than the initial Pd(hfac)2 to Cu(hfac)2·H2O ratio.
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