Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance
- Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance
- 노호균; 이승민; 배수강; 김태욱; 이동수; Hyun Jung Lee; 황준연; Tak Jeong; Sungmin Kim; Jun-Seok Ha; 이상현
- Graphene; Copper; Porous; Heat dissipation
- Issue Date
- Scientific Reports
- VOL 5
- Porous materials have historically been of interest for a wide range of applications in thermal
management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in these devices, calling for the development of new thermal management materials. Here, we report an effective technique for the synthesis of porous Cu-graphene heterostructures with pores of about 30 μm and a porosity of 35%. Graphene layers were grown on the surfaces of porous Cu, which was formed via the coalescence of molten Cu microparticles. The surface passivation with graphene layers resulted in a thermal conductivity higher than that of porous Cu, especially at high temperatures (approximately 40% at 1173 K). The improved heat dissipation properties of the porous structures were demonstrated by analysis of the thermal resistance and temperature distribution of LED chips mounted on the structures. The effective combination of the structural and material properties of porous Cu-graphene heterostructures provides a new material for effective thermal management of high-power electronic and optoelectronic devices.
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