Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance

Title
Three-Dimensional Porous Copper-Graphene Heterostructures with Durability and High Heat Dissipation Performance
Authors
노호균이승민배수강김태욱이동수Hyun Jung Lee황준연Tak JeongSungmin KimJun-Seok Ha이상현
Keywords
Graphene; Copper; Porous; Heat dissipation
Issue Date
2015-08
Publisher
Scientific Reports
Citation
VOL 5
Abstract
Porous materials have historically been of interest for a wide range of applications in thermal management, for example, in heat exchangers and thermal barriers. Rapid progress in electronic and optoelectronic technology necessitates more efficient spreading and dissipation of the heat generated in these devices, calling for the development of new thermal management materials. Here, we report an effective technique for the synthesis of porous Cu-graphene heterostructures with pores of about 30 μm and a porosity of 35%. Graphene layers were grown on the surfaces of porous Cu, which was formed via the coalescence of molten Cu microparticles. The surface passivation with graphene layers resulted in a thermal conductivity higher than that of porous Cu, especially at high temperatures (approximately 40% at 1173 K). The improved heat dissipation properties of the porous structures were demonstrated by analysis of the thermal resistance and temperature distribution of LED chips mounted on the structures. The effective combination of the structural and material properties of porous Cu-graphene heterostructures provides a new material for effective thermal management of high-power electronic and optoelectronic devices.
URI
http://pubs.kist.re.kr/handle/201004/50083
ISSN
20452322
Appears in Collections:
KIST Publication > Article
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