Biaxially strained Extremely-thin Body In0.53Ga0.47As-On-Insulator MOSFETs on Si substrates and Physical Understanding on their electron mobility
- Biaxially strained Extremely-thin Body In0.53Ga0.47As-On-Insulator MOSFETs on Si substrates and Physical Understanding on their electron mobility
- 김상현; Masafumi Yokoyama; Ryosho Nakane; Osamu Ichikawa; Takenori Osada; Masahiko Hata; Mitsuru Takenaka; Shinichi Takagi
- Issue Date
- Journal of applied physics
- VOL 114
- We report the electrical characteristics of strained In0.53Ga0.47As-on-insulator (-OI) metal-oxide-semiconductor field-effect-transistors (MOSFETs) on Si substrates fabricated by a direct wafer bonding (DWB) technique. 1.7% highly strained In0.53Ga0.47As-OI structures are fabricated on Si substrate by DWB. Strained In0.53Ga0.47As-OI MOSFETs with Ni-InGaAs metal source/drain (S/D) have been operated with high on-current (I on)/off-current (I off) ratio of ∼105 and good current saturation in output characteristics. MOSFETs with 1.7% tensile strain exhibits 1.65 × effective mobility (μ eff) enhancement against In0.53Ga0.47As MOSFET without strain. We found that this μ eff enhancement is attributed to the increase in mobile free electron concentration under tensile strain, which leads to the lowering in the conduction band minimum (CBM) and the increase in the energy difference between CBM and the Fermi level pinning position due to a large amount of interface states by Hall measurements.
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