A 32×32 Integrated CMUT Array for Volumetric Ultrasound Imaging

Title
A 32×32 Integrated CMUT Array for Volumetric Ultrasound Imaging
Authors
Anshuman BhuyanChienliu ChangJung Woo Choe이병철Amin NikoozadehOmer OralkanButrus T. Khuri-Yakub
Issue Date
2013-07
Publisher
IEEE International Ultrasonics Symposium 2013
Citation
, 545-548
Abstract
Real-time 3D volumetric ultrasound imaging systems require transmit and receive circuitry to generate the ultrasound beam and process the received echo signals. Since a 2D array is required for 3D imaging, the complexity of building such a system is significantly higher, e.g., front-end electronics need to be interfaced to the transducer, a large number of elements need to be interfaced to the backend system and a large dataset needs to be processed. In this work, we present a 3D imaging system using capacitive micromachined ultrasonic transducer (CMUT) technology that addresses many of the challenges in building such a system. The transducer is a 5-MHz CMUT array with an 8 mm × 8 mm aperture size. The aperture consists of 1024 elements (32×32) with an element pitch of 250 μm. An integrated circuit (IC) is integrated very close to the CMUT array. It consists of a transmit beamformer and receive circuitry to improve the noise performance of the overall system. Simultaneous multi-beam transmit is also incorporated in the IC to improve the imaging frame rate. The CMUT is flip-chip bonded to the IC and the final assembly measured 9.2 mm × 9.2 mm. The assembly was then interfaced with an FPGA and a backend system (comprising of a data acquisition system and PC). The FPGA provided the digital I/O signals for the IC and the backend system was used to process the received RF echo data (from the IC) and reconstruct the volume image using a phased array imaging approach. Imaging experiments were performed using wire phantoms. Real-time volumetric images were captured at 5 volumes per second and are presented in this paper.
URI
http://pubs.kist.re.kr/handle/201004/58508
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KIST Publication > Conference Paper
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