3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

Title
3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology
Authors
Anshuman BhuyanJung Woo Choe이병철Ira WygantAmin NikoozadehOmer OralkanButrus T. Khuri-Yakub
Issue Date
2013-02
Publisher
IEEE International Solid-State Circuits Conference Digest of Technical Papers 2013
Citation
, 396-397
URI
http://pubs.kist.re.kr/handle/201004/58510
Appears in Collections:
KIST Publication > Conference Paper
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