Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques

Title
Fabrication of InGaAs-on-Insulator Substrates Using Direct Wafer-Bonding and Epitaxial Lift-Off Techniques
Authors
최원준송진동김형준김상현심재필김한성김성광금대명Chang Zoo KimSung Jin ChoiDae Hwan KimDong Myong Kim
Issue Date
2017-08
Publisher
IEEE transactions on electron devices
Citation
VOL 64, NO 9
URI
http://pubs.kist.re.kr/handle/201004/61226
ISSN
00189383
Appears in Collections:
KIST Publication > Article
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