Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si Substrates

Title
Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si Substrates
Authors
김형준김상현
Keywords
wafer bonding; III-V; MOSFET; M3D
Issue Date
2016-11
Publisher
International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2016)
URI
http://pubs.kist.re.kr/handle/201004/64797
Appears in Collections:
KIST Publication > Conference Paper
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