Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites
- Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites
- 홍순만; 구종민; 유승건; 박규섭; 이장우; 박철민; 한태희
- thermal conductivity; low percolation; composite materials; electroplating; Cu; carbon fiber
- Issue Date
- Macromolecular research
- VOL 25, NO 6-564
- Enhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway.
- Appears in Collections:
- KIST Publication > Article
- Files in This Item:
There are no files associated with this item.
- RIS (EndNote)
- XLS (Excel)
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.