Graphene-Carbon-Metal Composite Film for a Flexible Heat Sink
- Graphene-Carbon-Metal Composite Film for a Flexible Heat Sink
- 김명종; 이상현; 서태훈; 탕 비엣 팜; 노호균; 김준희; 조현진; 채수형; 김학용; 하준석; 김환철
- graphene; composite; heat sink
- Issue Date
- ACS Applied Materials & Interfaces
- VOL 9, NO 46-40809
- The heat generated from electronic devices such as light emitting diodes (LEDs), batteries, and highly integrated transistors is one of the major causes obstructing the improvement of their performance and reliability. Herein, we report a comprehensive method to dissipate the generated heat to a vast area by using the new type of graphene– carbon– metal composite film as a heat sink. The unique porous graphene– metal composite film that consists of an electrospun carbon nanofiber with arc-graphene (Arc-G) fillers and an electrochemically deposited copper (Cu) layer showed not only high electrical and thermal conductivity but also high mechanical stability. Accordingly, superior thermal management of LED devices to that of conventional Cu plates and excellent resistance stability during the repeated 10  000 bending cycles has been achieved. The heat dissipation of LEDs has been enhanced by the high heat conduction in the composite film, heat convection in the air flow, and thermal radiation at low temperature in the porous carbon structure. This result reveals that the graphene– metal composite film is one of the most promising materials for a heat sink of electronic devices in modern electronics.
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