Highly adhesive and high fatigue-resistant copper/PET flexible electronic substrates
- Highly adhesive and high fatigue-resistant copper/PET flexible electronic substrates
- 문명운; 고태준; 박상진; 윤주일; 한준현; Kyu Hwan Oh
- nanohairy; high adhesion; Cu; Flexible substrates; Plasma treatment; Wettability; Adhesion; Fatigue
- Issue Date
- Applied surface science
- VOL 427, NO 1-9
- A voidless Cu/PET substrate is fabricated by producing a superhydrophilic PET surface comprised of nanostructures with large width and height and then by Cu electroless plating. Effect of PET surface nanostructure size on the failure mechanism of the Cu/PET substrate is studied. The fabricated Cu/PET substrate exhibits a maximum peel strength of 1300 N m− 1 without using an interlayer, and virtually no increase in electrical resistivity under the extreme cyclic bending condition of 1 mm curvature radius after 300 k cycles. The authors find that there is an optimum nanostructure size for the highest Cu/PET adhesion strength, and the failure mechanism of the Cu/PET flexible substrate depends on the PET surface nanostructure size. Thus, this work presents the possibility to produce flexible metal/polymer electronic substrates that have excellent interfacial adhesion between the metal and polymer and high fatigue resistance against repeated bending. Such metal/polymer substrates provides new design opportunities for wearable electronic devices that can withstand harsh environments and have extended lifetimes.
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