Highly adhesive and high fatigue-resistant copper/PET flexible electronic substrates

Title
Highly adhesive and high fatigue-resistant copper/PET flexible electronic substrates
Authors
문명운고태준박상진윤주일한준현Kyu Hwan Oh
Keywords
nanohairy; high adhesion; Cu; Flexible substrates; Plasma treatment; Wettability; Adhesion; Fatigue
Issue Date
2018-01
Publisher
Applied surface science
Citation
VOL 427, NO 1-9
Abstract
A voidless Cu/PET substrate is fabricated by producing a superhydrophilic PET surface comprised of nanostructures with large width and height and then by Cu electroless plating. Effect of PET surface nanostructure size on the failure mechanism of the Cu/PET substrate is studied. The fabricated Cu/PET substrate exhibits a maximum peel strength of 1300 N m− 1 without using an interlayer, and virtually no increase in electrical resistivity under the extreme cyclic bending condition of 1 mm curvature radius after 300 k cycles. The authors find that there is an optimum nanostructure size for the highest Cu/PET adhesion strength, and the failure mechanism of the Cu/PET flexible substrate depends on the PET surface nanostructure size. Thus, this work presents the possibility to produce flexible metal/polymer electronic substrates that have excellent interfacial adhesion between the metal and polymer and high fatigue resistance against repeated bending. Such metal/polymer substrates provides new design opportunities for wearable electronic devices that can withstand harsh environments and have extended lifetimes.
URI
http://pubs.kist.re.kr/handle/201004/66840
ISSN
0169-4332
Appears in Collections:
KIST Publication > Article
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