Copper circuit patterning on polymer using selective surface modification and electroless plating

Title
Copper circuit patterning on polymer using selective surface modification and electroless plating
Authors
문명운고태준박상진윤주일오규환한준현
Keywords
nanohairy; adhesion; cu; Flexible electronics; Plasma treatent; Microstructure; Electroless plating
Issue Date
2017-02
Publisher
Applied surface science
Citation
VOL 396-1684
Abstract
We have examined a potential new and simple method for patterning a copper circuit on PET substrate by copper electroless plating, without the pretreatment steps (i.e., sensitization and activation) for electroless plating as well as the etching processes of conventional circuit patterning. A patterned mask coated with a catalyst material, Ag, for the reduction of Cu ions, is placed on a PET substrate. Subsequent oxygen plasma treatment of the PET substrate covered with the mask promotes the selective generation of anisotropic pillar- or hair-like nanostructures coated with co-deposited nanoparticles of the catalyst material on PET. After oxygen plasma treatment, a Cu circuit is well formed just by dipping the plasma treated PET into a Cu electroless plating solution. By increasing the oxygen gas pressure in the chamber, the height of the nanostructures increases and the Ag catalyst particles are coated on not only the top but also the side surfaces of the nanostructures. Strong mechanical interlocking between the Cu circuit and PET substrate is produced by the large surface area of the nanostructures, and enhances peel strength. Results indicate this new simple two step (plasma surface modification and pretreatment-free electroless plating) method can be used to produce a flexible Cu circuit with good adhesion.
URI
http://pubs.kist.re.kr/handle/201004/66841
ISSN
0169-4332
Appears in Collections:
KIST Publication > Article
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