The third dimension: The logical step for III-Vs

Title
The third dimension: The logical step for III-Vs
Authors
김형준김상현김성광
Keywords
III-V compound semiconductor; wafer bonding; epitaxial lift-off; field effect transistor; monolithic 3D integration
Issue Date
2017-06
Publisher
CS Magazine
Citation
VOL 23, NO 4-46
URI
http://pubs.kist.re.kr/handle/201004/67236
ISSN
2042-7328
Appears in Collections:
KIST Publication > ETC
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