Universal solders for direct bonding and packaging of optical devices
- Universal solders for direct bonding and packaging of optical devices
- 천동원; Chin-Hung Liu; Young Jin Kim; Gunwoo Kim; Renkun Chen; Anthony W. Yu; Sungho Jin
- Lead-free universalsolder; Low-temperaturesoldering; Non-linear optics; Thermal management
- Issue Date
- Materials letters
- VOL 152, NO 1-236
- For optical packaging, there is a need to directly bond non-solderable materials such as oxides, nitrides, borides and fluorides, which are very difficult to wet/bond with low melting point solders, for example, at similar to 150 degrees C or below. In this research, we describe new Pb-free universal solders with low melting point of 140 degrees C or below by doping with a small amount of rare-earth elements, especially inexpensive mischmetals, which allow direct and powerful bonding onto the surfaces of various optical and electronic devices. The microstructure of the solder bonds is described, and their potential applications for passive and active optical components assembly are discussed.
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