Universal solders for direct bonding and packaging of optical devices

Title
Universal solders for direct bonding and packaging of optical devices
Authors
천동원Chin-Hung LiuYoung Jin KimGunwoo KimRenkun ChenAnthony W. YuSungho Jin
Keywords
Lead-free universalsolder; Low-temperaturesoldering; Non-linear optics; Thermal management
Issue Date
2015-08
Publisher
Materials letters
Citation
VOL 152, NO 1-236
Abstract
For optical packaging, there is a need to directly bond non-solderable materials such as oxides, nitrides, borides and fluorides, which are very difficult to wet/bond with low melting point solders, for example, at similar to 150 degrees C or below. In this research, we describe new Pb-free universal solders with low melting point of 140 degrees C or below by doping with a small amount of rare-earth elements, especially inexpensive mischmetals, which allow direct and powerful bonding onto the surfaces of various optical and electronic devices. The microstructure of the solder bonds is described, and their potential applications for passive and active optical components assembly are discussed.
URI
http://pubs.kist.re.kr/handle/201004/67313
ISSN
0167-577X
Appears in Collections:
KIST Publication > Article
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE