Performance of WCN diffusion barrier for Cu multilevel interconnects

Title
Performance of WCN diffusion barrier for Cu multilevel interconnects
Authors
김용태이승연주병권
Keywords
WCN diffusion barrier; Cu; Multilevel interconnects; low resistivity; Cu migration; low contact resistance; high temp. reliability
Issue Date
2018-04
Publisher
Japanese Journal of Applied Physics, Part 1- Regular Papers
Citation
VOL 57, NO 4-04FC01-4
Abstract
The electrical and thermal properties of a WCN diffusion barrier have been studied for Cu multilevel interconnects. The WCN has been prepared using an atomic layer deposition system with WF6– CH4– NH3– H2 gases and has a very low resistivity of 100 μΩcm and 96.9% step coverage on the high-aspect-ratio vias. The thermally stable WCN maintains an amorphous state at 800 °C and Cu/WCN contact resistance remains within a 10% deviation from the initial value after 700 °C. The mean time to failure suggests that the Cu/WCN interconnects have a longer lifetime than Cu/TaN and Cu/WN interconnects because WCN prevents Cu migration owing to the stress evolution from tensile to compressive
URI
http://pubs.kist.re.kr/handle/201004/67337
ISSN
0021-4922
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KIST Publication > Article
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