Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion

Title
Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion
Authors
김종식Jong Cheol KimYan XinJinhyung LeeYoung-Gyun KimGhatu SubhashRajiv K. SinghArul C. ArjunanHaigun Lee
Issue Date
2018-05
Publisher
Applied physics letters
Citation
VOL 112, NO 21-211601-4
Abstract
The continuous demand on miniaturized electronic circuits bearing high power density illuminates the need to modify the silicon-on-insulator-based chip architecture. This is because of the low thermal conductivity of the few hundred nanometer-thick insulator present between the silicon substrate and active layers. The thick insulator is notorious for releasing the heat generated from the active layers during the operation of devices, leading to degradation in their performance and thus reducing their lifetime. To avoid the heat accumulation, we propose a method to fabricate the silicon-on-diamond (SOD) microstructure featured by an exceptionally thin silicon oxycarbide interlayer (3 nm). While exploiting the diamond as an insulator, we employ spark plasma sintering to render the silicon directly fused to the diamond. Notably, this process can manufacture the SOD microarchitecture via a simple/rapid way and incorporates the ultra-thin interlayer for minute thermal resistance. The method invented herein expects to minimize the thermal interfacial resistance of the devices and is thus deemed as a breakthrough appealing to the current chip industry.
URI
http://pubs.kist.re.kr/handle/201004/67651
ISSN
0003-6951
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KIST Publication > Article
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