Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits
- Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits
- 이중기; 왕만상; 엥가르; Guicheng Liu; Lei Wang; Jinrong Lu; Jing Lu
- Liquid metal; Printed electronics; weting processing; Printed paper; Direct writing
- Issue Date
- JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS
- VOL 95-207
- Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.
- Appears in Collections:
- KIST Publication > Article
- Files in This Item:
There are no files associated with this item.
- RIS (EndNote)
- XLS (Excel)
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.