Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits

Title
Enhanced adhesion between liquid metal ink and the wetted printer paper for direct writing electronic circuits
Authors
이중기왕만상엥가르Guicheng LiuLei WangJinrong LuJing Lu
Keywords
Liquid metal; Printed electronics; weting processing; Printed paper; Direct writing
Issue Date
2019-02
Publisher
JOURNAL OF THE TAIWAN INSTITUTE OF CHEMICAL ENGINEERS
Citation
VOL 95-207
Abstract
Liquid metal (In75.4 Ga24.5, LM) with its high electrical conductivity and flexibility at room temperature, has been gradually introduced into printed electronics. However, the low adhesion effect of LM on the common printer paper may restrict its potential value in reducing cost and expanding use. In this study, the surface property of the printer paper has been modified by a wetting method with a coating of micro-size droplets on the paper surface to realize a smooth writing process using the liquid metal ink. The current strategy is expected to enable future flexible electronic circuits on the hard writing substrates.
URI
http://pubs.kist.re.kr/handle/201004/69117
ISSN
1876-1070
Appears in Collections:
KIST Publication > Article
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