Optimizing Filler Network Formation in Polymer Composites for Packaging Material with High Thermal Conductivity
- Optimizing Filler Network Formation in Polymer Composites for Packaging Material with High Thermal Conductivity
- 고문주; 김채빈; 이장건; 신하은; 박찬희
- Issue Date
- 2019년 한국고분자학회 춘계학술대회
- The shape, size, and orientation of fillers within polymeric matrix are important factors for realizing various composite functionalities. In our previous work, we found a unique thermally stiffening but malleable characteristic of poly(hexahydrotriazine) (PHT) and exploited this characteristic to maximize anisotropic model hexagonal boron nitride (h-BN) alignment within the PHT by leveraging shear force generated upon manufacturing the composite. Consequently, the final composite exhibited exceptionally high thermal conductivity of 28 W/mK. In this presentation, we will report a detailed comprehensive study regarding a relationship between composite thermal conductivity and the filler type, shape, size, and also its degree of alignment. To further highlight versatility, the composite bearing highly aligned h-BN was applied as gas barrier. We believe the PHT composite material could be useful as packaging material for microelectronics which could also quickly dissipate the generated heat from the electronics to the surroundings.
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