Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications

Title
Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications
Authors
최원준송진동김형준한재훈김상현
Keywords
Wafer bonding; Heterogeneous integration; Bonding interface; Monolithic 3D integration
Issue Date
2019-01
Publisher
Journal of the Korean Physical Society
Citation
VOL 74, NO 2-87
Abstract
Recently, heterogeneous integration has become more important in enhancing device performance and creating new functions. For this purpose, wafer bonding can provide a straightforward method to integrate different materials, regardless of lattice mismatch. Here, we review recent application spaces using low-temperature wafer bonding by classifying wafer bonding into direct bonding, oxide bonding, and metal bonding. We show that bonding materials and interfaces have an important role in achieving high-performance semiconductor devices.
URI
http://pubs.kist.re.kr/handle/201004/69537
ISSN
0374-4884
Appears in Collections:
KIST Publication > Article
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