Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction

Title
Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction
Authors
홍순만구종민노석진홍준표이승환유승건Faisal Shahzad김우년
Issue Date
2019-09
Publisher
Composites science and technology
Citation
VOL 182-107778-7
Abstract
Metal-coated polymer bead based composites are promising as electromagnetic interference (EMI) shielding and thermally conductive materials because they form a percolation 3D metal shell network at very low filler content. Herein, we fabricated 3D Cu/Ag shell network composites through electroless plating of metal on polymer beads and a simple hot pressing technique. Cu and Ag shells provide a continuous network for electron and heat conduction; thus, yielding excellent EMI shielding effectiveness of 110  dB  at a 0.5  mm thickness and a thermal conductivity of 16.1  W  m− 1K− 1  at only 13  vol % of metal filler. The properties of composites depend on the size of polystyrene (PS) beads and large size metal-coated PS bead composites exhibit higher electrical conductivity, EMI shielding effectiveness, and thermal conductivity than small size bead composites. These results are ascribed to the reduction in the number of contact interfaces between metal-coated beads, which minimizes the interfacial resistance. This study is set to pave the way for designing advanced EMI shielding and thermal conductive materials by a scalable and efficient synthesis approach.
URI
http://pubs.kist.re.kr/handle/201004/69716
ISSN
0266-3538
Appears in Collections:
KIST Publication > Article
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