3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage
- 3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage
- 손해정; 이필립; 배승환; 강병수; 황석준; 조만식; 오인종; 정지훈; 이승섭; 문병무; 고민재
- 고유연 태양전지; 3D 프린터; 오리가미; 키리가미; 봉지 기술; 전도성 나노물질; 페로브스카이트 태양전지; 고신축성 전도체
- Issue Date
- ACS Nano
- VOL 13, NO 11-12510
- Stretchability and areal coverage of active devices are critical design considerations of stretchable or wearable photovoltaics and photodetections where high areal coverages are required. However, simultaneously maximizing both properties in conventional island-bridge structures through traditional two-dimensional manufacturing processes is difficult due to their inherent trade-offs. Here, a 3D printer-based strategy to achieve extreme system stretchability and high areal coverage through combining fused deposition modeling (FDM) and flexible conductive nanocomposites is reported. Distinguished from typical approaches of using conductive filaments for FDM which have a flexibility dilemma and conductivity trade-offs, the proposed axiomatic approach to embed a two-dimensional silver nanowire percolation network into the surfaces of flexible 3D printed structures offers sufficient conductivity and deformability as well as additional benefits of electrical junction enhancement and encapsulation of silver nanowires. Kirigami/origami-pattern-guided three-dimensional arrangements of encapsulated interconnections provide efficient control over stretchability and areal coverage. The suggested process enables a perovskite solar module with an initial areal coverage of ∼97% to be electrically and mechanically reversible with 400% system stretchability and 25  000% interconnect stretchability under the 1000 cycle test, by folding down or hiding the origami-applied interconnects under the islands. This 3D printing strategy of potentially low cost, large size capabilities, and high speed is promising for highly flexible future energy conversion applications.
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