Transfer of transition-metal dichalcogenide circuits onto arbitrary substrates for flexible device application

Title
Transfer of transition-metal dichalcogenide circuits onto arbitrary substrates for flexible device application
Authors
안재평김양희이혜빈이국진지현진최준희김민식김규태
Issue Date
2019-12
Publisher
Nanoscale
Citation
VOL 11, NO 45-22124
Abstract
Transition-metal dichalcogenide (TMD) materials with two-dimensional layered structures and stable surfaces are well suited for transparent and flexible device applications. In order to completely utilize the advantages of thickness control and fabrication of various heterostructure stacks, we proposed a transfer method of TMD field-effect transistors (FETs) and TMD complementary metal– oxide– semiconductor (CMOS) circuits from a Si/SiO2 substrate to a flexible substrate. We compared the characteristics of transferred MoS2 and WSe2 FETs with those of the corresponding devices transferred after channel passivation with an Al2O3 layer on a flexible substrate. Al2O3 passivation further stabilized the transfer of the entire device with electrodes. A CMOS circuit with MoS2 and WSe2 materials could be successfully transferred to a polyethylene terephthalate substrate after the channel passivation. This implies that TMD circuits can be easily fabricated on polymer substrates, which makes them suitable for use in semiconductor processes, for various applications.
URI
http://pubs.kist.re.kr/handle/201004/70696
ISSN
2040-3364
Appears in Collections:
KIST Publication > Article
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