Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core?Shell Structured Fillers and Silicone Polymers

Title
Thermal Conductivity and Electromagnetic Interference (EMI) Absorbing Properties of Composite Sheets Composed of Dry Processed Core?Shell Structured Fillers and Silicone Polymers
Authors
김상우최현석박지원이경섭Su-Jeong Suh
Keywords
dual-functional sheet; thermal conductivity; inter-decoupling ratio; core?shell structured fillers; dielectric breakdown voltage
Issue Date
2020-10
Publisher
Polymers
Citation
VOL 12, 2318
Abstract
This paper proposes dual-functional sheets (DFSs) that simultaneously have high thermal conductivity (TC) and electromagnetic interference (EMI) absorbing properties, making them suitable for use in mobile electronics. By adopting a simple but highly efficient dry process for manufacturing core?shell structured fillers (CSSFs) and formulating a close-packed filler composition, the DFSs show high performance, TC of 5.1 W m?1 K?1, and a ?4 dB inter-decoupling ratio (IDR) at a 1 GHz frequency. Especially, the DFSs show a high dielectric breakdown voltage (BDV) of 3 kV mm?1, which is beneficial for application in most electronic devices. The DFSs consist of two kinds of CSSFs that are blended in accordance with the close-packing rule, Horsfield’s packing model, and with polydimethylsiloxane (PDMS) polymers. The core materials are soft magnetic Fe-12.5%Cr and Fe-6.5%Si alloy powders of different sizes, and Al2O3 ceramic powders of a 1-μm diameter are used as the shell material. The high performance of the DFS is supposed to originate from the thick and stable shell layer and the maximized filler loading capability owing to the close-packed structure.
URI
http://pubs.kist.re.kr/handle/201004/72109
ISSN
2073-4360
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KIST Publication > Article
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