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dc.contributor.author이중기-
dc.contributor.author엥가르-
dc.contributor.authorGuicheng Liu-
dc.date.accessioned2021-06-09T04:26:19Z-
dc.date.available2021-06-09T04:26:19Z-
dc.date.issued2021-04-
dc.identifier.citationVOL 6-1442-
dc.identifier.issn2380-8195-
dc.identifier.other56745-
dc.identifier.urihttp://pubs.kist.re.kr/handle/201004/73040-
dc.description.abstractLi-metal is an attractive anode material for next-generation batteries owing to its high capacity and low reduction potential. Unfortunately, it undergoes dendritic growth, which limits its development. Herein, amorphous polymeric carbon-based semiconducting passivation layers are applied to Li-metal electrodes using radiofrequency plasma thermal evaporation to suppress dendrite growth. The plasma power is controlled to adjust the semiconducting type and mechanical properties of the plasma-polymerized carbon layer (PCL). n- and p-type semiconducting PCLs (n- and p-PCLs) form ohmic and Schottky contacts, respectively, with the Li-metal. p-PCL was more effective than n-PCL at suppressing Li-dendrite formation, as the former enhanced the modulus and Li-ion conductivity, inducing Li-ion deposition below the passivation layer. The p-PCL-coated Li electrode maintains state-of-the-art stable dendrite-free cycling behavior with overpotentials of ∼11.10 and ∼79.84 mV over 16?450 and 2472 h at 1 and 10 mA cm?2, respectively.-
dc.publisherACS energy letters-
dc.subjectMetal-Semiconductor-
dc.subjectOhimic and Schottky contact-
dc.subjectInterface-
dc.subjectStable-
dc.subjectLi-Metal Electrodes-
dc.titleMetal-Semiconductor Ohmic and Schottky Contact Interfaces for Stable Li-Metal Electrodes-
dc.typeArticle-
dc.relation.page14321442-
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