Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects

Title
Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnects
Authors
황준연남정태손명우장재원이용수In S Kim이병훈함문호지상수
Keywords
graphene; hybrid structure; heterostructure; interconnects; TEM
Issue Date
2021-04
Publisher
NPJ 2D MATERIALS AND APPLICATIONS
Citation
VOL 5, 41
URI
http://pubs.kist.re.kr/handle/201004/73590
ISSN
2397-7132
Appears in Collections:
KIST Publication > Article
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