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dc.contributor.authorKIM, KYUNGSU-
dc.contributor.authorWoo-Youl Maeng-
dc.contributor.authorKIM, SEONGCHAN-
dc.contributor.authorGyubok Lee e-
dc.contributor.authorMinki Hong-
dc.contributor.authorKim ga-been-
dc.contributor.authorJaewon Kim-
dc.contributor.authorSungeun Kim-
dc.contributor.authorSeunghun Han-
dc.contributor.authorJaeyoung Yoo-
dc.contributor.authorLEE, HYO JIN-
dc.contributor.authorKangwon Lee-
dc.contributor.authorJahyun Koo-
dc.date.accessioned2024-01-12T02:32:42Z-
dc.date.available2024-01-12T02:32:42Z-
dc.date.created2023-01-12-
dc.date.issued2023-02-
dc.identifier.issn2590-0064-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/75822-
dc.description.abstractBioresorbable implantable medical devices can be employed in versatile clinical scenarios that burden patients with complications and surgical removal of conventional devices. However, a shortage of suitable electrical interconnection materials limits the development of bioresorbable electronic systems. Therefore, this study highlights a highly conductive, naturally resorbable paste exhibiting enhanced electrical conductivity and mechanical stability that can solve the existing problems of bioresorbable interconnections. Multifaceted experiments on electrical and physical properties were used to optimize the composition of pastes containing beeswax, submicron tungsten particles, and glycofurol. These pastes embody isotropic conductive paths for three-dimensional interconnects and function as antennas, sensors, and contact pads for bioresorbable electronic devices. The degradation behavior in aqueous solutions was used to assess its stability and ability to retain electrical conductance (-7 kS/m) and structural form over the requisite dissolution period. In vitro and in vivo biocompatibility tests clarified the safety of the paste as an implantable material.-
dc.languageEnglish-
dc.publisherElsevier-
dc.titleIsotropic conductive paste for bioresorbable electronics-
dc.typeArticle-
dc.identifier.doi10.1016/j.mtbio.2023.100541-
dc.description.journalClass1-
dc.identifier.bibliographicCitationMaterials Today Bio, v.18, pp.1 - 15-
dc.citation.titleMaterials Today Bio-
dc.citation.volume18-
dc.citation.startPage1-
dc.citation.endPage15-
dc.description.isOpenAccessY-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000925303000001-
dc.relation.journalWebOfScienceCategoryEngineering, Biomedical-
dc.relation.journalWebOfScienceCategoryMaterials Science, Biomaterials-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusPERCOLATION-THRESHOLD-
dc.subject.keywordPlusTRANSIENT-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusBIOCOMPATIBILITY-
dc.subject.keywordPlusNANOPARTICLES-
dc.subject.keywordPlusWETTABILITY-
dc.subject.keywordPlusCOMPOSITES-
dc.subject.keywordPlusADHESION-
dc.subject.keywordPlusBEESWAX-
dc.subject.keywordPlusSENSORS-
dc.subject.keywordAuthorIsotropic conductive adhesive-
dc.subject.keywordAuthorConductive paste-
dc.subject.keywordAuthorImplantable medical device-
dc.subject.keywordAuthorBiodegradable electronics-
dc.subject.keywordAuthorScreen printing-
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KIST Article > 2023
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