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Eco-friendly and super durable conducting paste with high adhesion strength and hardness based on natural lacquer sap

Authors

Lee Bora; Ho Sun Lim; 한호규; Doh Jung Mann; Cheolmin Park; Jung Ah Lim

Issue Date

2019-06

Publisher

한국전기전자재료학회

Citation

2019 한국전기전자재료학회 하계학술대회

ISSN

-

URI

https://pubs.kist.re.kr/handle/201004/78848

Appears in Collections:

KIST Conference Paper > 2019

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