고밀착력 무접착제 연성 회로기판 및 이의 연속적 제작 방법

Author
최원국박동희최형욱
Assignee
한국과학기술연구원
Regitration Date
2010-03-15
Registration No.
10-0948859
Application Date
2007-12-20
Application No.
2007-134160
Country
KO
URI
https://pubs.kist.re.kr/handle/201004/81194
Appears in Collections:
KIST Patent > 2007
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