Computer Simulation for Die Filling Behavior of Semi-Solid Slurry of Mg Alloy

Authors
MUN JOONG HWAKim, Ki BaeSeok, Hyun KwangSungbin KimYoungdo Kim
Issue Date
2005-07
Citation
Proceedings of the 2nd Japan-Korea Workshop for Young Foundry Engineers, pp.267 - 269
Keywords
Semi-solid forming; Rheology; Thixotropiy; Viscosity; Filling behavior; Mg alloy
URI
https://pubs.kist.re.kr/handle/201004/82027
Appears in Collections:
KIST Conference Paper > 2005
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