Organo-soluble, segmented rigid-rod polyimide films: 2. Properties for microelectronic applications.

Title
Organo-soluble, segmented rigid-rod polyimide films: 2. Properties for microelectronic applications.
Authors
Fred E. Arnold Jr.Stephen Z. D. ChengSteven L.-C. Hsu이철주Frank W. HarrisSuk-Fai Lau
Keywords
coefficient of thermal expansion; dimensional stability; glass transition temperature; microelectronic application; relative permittivity; segmented rigid-rod polyimide film; thermal and thermo-oxidative stability; thermogravimetric mass spectroscopy; thermomechanical measurement
Issue Date
1992-01
Publisher
Polymer
Citation
v. 33, no. 24, 5179-5185
URI
http://pubs.kist.re.kr/handle/201004/8407
ISSN
0032-3861
Appears in Collections:
KIST Publication > Article
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