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경질 탄소필름이 코팅된 반도체 봉지용 ＥＭＣ 몰드금형과 그 코팅방법

Author

전영하; 이광렬

Assignee

한국과학기술연구원

Regitration Date

2005-05-04

Registration No.

0489639

Application Date

2002-11-22

Application No.

2002-0073209

Country

KO

URI

https://pubs.kist.re.kr/handle/201004/87502

Appears in Collections:

KIST Patent > 2002

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