The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

Title
The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au
Authors
송호건안재평J.W. Morris, Jr.
Keywords
Au-Sn solder; electroless Ni/Au metallization; Au-Ni-Sn compounds
Issue Date
2001-09
Publisher
Journal of electronic materials
Citation
VOL 30, NO 9, 1083-1087
URI
http://pubs.kist.re.kr/handle/201004/8773
ISSN
0361-5235
Appears in Collections:
KIST Publication > Article
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