Characteristics of amorphous Ta-Si-N thin film for Cu metallization

Title
Characteristics of amorphous Ta-Si-N thin film for Cu metallization
Authors
김동준정순필김용태민석기박종완
Keywords
Ta-Si-N; Cu metallization; amorphous; diffusion barrier
Issue Date
1997-02
Publisher
제4회 한국 반도체 학술대회 (The 4th Korean conference on semiconductors) 논문집
Citation
, 373-374
URI
http://pubs.kist.re.kr/handle/201004/8962
Appears in Collections:
KIST Publication > Conference Paper
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