Electromigration-induced stress interaction between via and polygranular cluster

Title
Electromigration-induced stress interaction between via and polygranular cluster
Authors
박영준최인석주영창
Keywords
electromigration; stress; simulation
Issue Date
2001-01
Publisher
Mat. Res. Soc. Symp. Proc.
Citation
VOL 612, D8.11.1-D8.11.6
URI
http://pubs.kist.re.kr/handle/201004/9097
Appears in Collections:
KIST Publication > Conference Paper
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