Study on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding

Title
Study on pre-bonding according with HF pre-treatment conditions in Si wafer direct bonding
Authors
강경두박진성정수태주병권정귀상
Issue Date
1999-05
Publisher
한국전기전자재료학회 '99 춘계학술대회 논문집
Citation
, 370-373
URI
http://pubs.kist.re.kr/handle/201004/9217
Appears in Collections:
KIST Publication > Conference Paper
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