DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorKim, Young-Hwan-
dc.contributor.authorYeong-Hyeon Hwang-
dc.contributor.authorWon-Ju Cho-
dc.contributor.authorKim, Yong Tae-
dc.date.accessioned2024-01-12T20:06:48Z-
dc.date.available2024-01-12T20:06:48Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/95710-
dc.languageEnglish-
dc.subjectWN-
dc.subjectdiffusion barrier-
dc.subjectCu nano via/contact-
dc.subjectAtomic layer deposition-
dc.titleA new atomic layer deposition method and electrical performance of WN diffusion barrier for Cu nano via contact structures-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationEuropean Materials Research Society (E-MRS), 2012-
dc.citation.titleEuropean Materials Research Society (E-MRS), 2012-
dc.citation.conferencePlaceFR-
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