Interconnect failure mechanism maps for different metallization materials and processes

Title
Interconnect failure mechanism maps for different metallization materials and processes
Authors
V. K. Andleigh박영준C. V. Thompson
Keywords
electromigration; reliability
Issue Date
1999-11
Publisher
Materials Reliability in Microelectronics IX (Mat. Res. Soc. Symp. Proc. v.563)
Citation
VOL 563, 59-64
URI
http://pubs.kist.re.kr/handle/201004/9630
Appears in Collections:
KIST Publication > Conference Paper
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