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dc.contributor.authorV. K. Andleigh-
dc.contributor.author박영준-
dc.contributor.authorC. V. Thompson-
dc.date.accessioned2015-12-02T03:25:50Z-
dc.date.available2015-12-02T03:25:50Z-
dc.date.issued199911-
dc.identifier.citationVOL 563, 59-64-
dc.identifier.other10574-
dc.identifier.urihttp://pubs.kist.re.kr/handle/201004/9630-
dc.publisherMaterials Reliability in Microelectronics IX (Mat. Res. Soc. Symp. Proc. v.563)-
dc.subjectelectromigration-
dc.subjectreliability-
dc.titleInterconnect failure mechanism maps for different metallization materials and processes-
dc.typeConference Paper-
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