반도체용 Interconnect (Al-2Cu) 에서 reliability향상에 대한 열처리의 영향

Title
반도체용 Interconnect (Al-2Cu) 에서 reliability향상에 대한 열처리의 영향
Authors
한준현신명철
Keywords
semiconductor; interconnect; realiability
Issue Date
1996-11
Publisher
한국분석과학회 학술대회
Citation
, 8-8
URI
http://pubs.kist.re.kr/handle/201004/9640
Appears in Collections:
KIST Publication > Conference Paper
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