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dc.contributor.authorKim, Yong Tae-
dc.contributor.authorKim, Young-Hwan-
dc.contributor.authorKim, Seong Il-
dc.date.accessioned2024-01-12T21:06:26Z-
dc.date.available2024-01-12T21:06:26Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/96801-
dc.languageEnglish-
dc.subjectElectromigration-
dc.subjectcopper-
dc.subjectinterconnect-
dc.subjectdiffusion barrier-
dc.subjectALD-
dc.subjectWN-
dc.titleElectromigration test of a new Cu/WN/MSQ/Si interconnect structure-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationAsia Pacific Interdisciplinary Research Conf.2011, pp.18pp-23-
dc.citation.titleAsia Pacific Interdisciplinary Research Conf.2011-
dc.citation.startPage18pp-23-
dc.citation.endPage18pp-23-
dc.citation.conferencePlaceJA-
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